題目：Post buckling analysis and its applications on stretchable electronics and micro assembly structures

時間：2018年9月25日（星期二）下午15：00

報告人：師巖副研究員（南京航空航天大學航空宇航學院）

地點：明故宮校區A18-209會議室

主辦單位：機械結構力學及控制國家重點實驗室、航空宇航學院、航空航天交叉研究院

報告摘要：

    Inorganic stretchable electronics is an emerging technology involving electronic components and circuits integrated on the soft elastomer substrate to form the functional device with excellent stretchability. Along with the development of the multidisciplinary science, stretchable electronics has exploited many significant applications in biomedicine, nanotechnology, communications and customer electronics. Some emerging technologies and products such as stretchable circuits, transfer printing, electronic eye cameraand flexible battery. The development of the emerging technologies, such as stretchable electronics poses challenges to micro fabrications. The recently reported technology that combines micro fabrication with origami Kirigami art builds an emerging technology for autonomic origami assembly of 3D structures across material classes from soft polymers to brittle inorganic semiconductors, and length scales from nanometers to centimeters.

    Structure buckling plays an important role in design and fabrication of the stretchable electronics. In design of “island bridge structure”, the deformations are mainly undertook by the buckled interconnects, which induces the excellent stretching bending properties of the whole devices. In the area of buckling induced origami assembly of 3D structures, the buckling behavior of structures also plays an important role in assembling process and final configurations. Many papers have been published on the research of elastic buckling behaviors of semiconductor or high polymer membranes. But little research has done on the elastic-plastic buckling behavior of metallic film structures and its influence on the configurations of 3D structures.

    Faced with these problems, in current work, the buckling behaviors in designs and fabrications of flexible plasmonics and three dimensional assembly of metallic film structures are studied. We focus on the relevant problems of buckling behavior which include mechanics analysis, post-buckling configurations and structure optimizations.

Keywords: Flexible electronics, Self-assembly, Post-buckling, Optimization design

報告人簡介：

    師巖，航空航天交叉研究院副研究員。于2009年和2015年在南京航空航天大學分別獲得學士和博士學位。曾在美國西北大學交流訪問兩年，并于博士畢業后在清華大學固體力學博士后工作站工作兩年，于2017年進入交叉研究工作，2018年入選南京航空航天大學“長空學者”人才計劃。研究領域包括智能材料斷裂力學、柔性電子器件的力學建模、微/納尺度折紙結構等。師巖副研究員共發表期刊論文30余篇，SCI收錄22篇。其中包括Cell，Nature Materials，Nature Communications，PNAS等國際頂尖期刊論文。